D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, PDIP24, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | compliant |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY |
| Input format | PARALLEL, 8 BITS |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| Maximum linear error (EL) | 0.0122% |
| Nominal negative supply voltage | -5 V |
| Number of digits | 12 |
| Number of functions | 4 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| Nominal settling time (tstl) | 5 µs |
| Maximum slew rate | 18 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MAX257CENG | MAX257DEWG | MAX257DMYG | MAX257DC/D | MAX257DCWG | MAX257CMYG | |
|---|---|---|---|---|---|---|
| Description | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, PDIP24, PLASTIC, DIP-24 | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, PDSO24, SO-24 | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, CDIP24, SIDE BRAZED, CERAMIC, DIP-24 | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, DIE-24 | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, PDSO24, SO-24 | D/A Converter, 4 Func, Parallel, 8 Bits Input Loading, 5us Settling Time, CDIP24, SIDE BRAZED, CERAMIC, DIP-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | SOIC | DIP | DIE | SOIC | DIP |
| package instruction | DIP, | SOP, | DIP, | DIE, | SOP, | DIP, |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| Input format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 code | R-PDIP-T24 | R-PDSO-G24 | R-CDIP-T24 | R-XUUC-N24 | R-PDSO-G24 | R-CDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Maximum linear error (EL) | 0.0122% | 0.0244% | 0.0244% | 0.0244% | 0.0244% | 0.0122% |
| Nominal negative supply voltage | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 85 °C | 85 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -55 °C | - | - | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | SOP | DIP | DIE | SOP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE | UNCASED CHIP | SMALL OUTLINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal settling time (tstl) | 5 µs | 5 µs | 5 µs | 5 µs | 5 µs | 5 µs |
| Maximum slew rate | 18 mA | 18 mA | 18 mA | 18 mA | 18 mA | 18 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maker | Maxim | - | Maxim | Maxim | Maxim | Maxim |
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