EEPROM, 256X8, Serial, CMOS, PDSO8, PLASTIC, SO-8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
Parts packaging code | SOIC |
package instruction | PLASTIC, SO-8 |
Contacts | 8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 2.1 MHz |
Data retention time - minimum | 40 |
Durability | 1000000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
length | 4.9 mm |
memory density | 2048 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 256 words |
character code | 256 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
organize | 256X8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Serial bus type | SPI |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms |
write protect | HARDWARE/SOFTWARE |