MB9BF617TPMC-GK7E1 datasheet, PDF

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MB9BF617TPMC-GK7E1: DescriptionRISC Microcontroller,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，134 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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MB9BF617TPMC-GK7E1 Overview

RISC Microcontroller,

MB9BF617TPMC-GK7E1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Cypress Semiconductor
package instruction	LFQFP,
Reach Compliance Code	compliant
Has ADC	YES
Address bus width	25
bit size	32
maximum clock frequency	50 MHz
DAC channel	NO
DMA channel	YES
External data bus width	16
JESD-30 code	S-PQFP-G176
length	24 mm
Number of I/O lines	154
Number of terminals	176
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
RAM (bytes)	98304
rom(word)	786432
ROM programmability	FLASH
Maximum seat height	1.7 mm
speed	144 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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MB9B610T Series

32-bit ARM

Cortex

-M3

FM3 Microcontroller

The MB9B610T Series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and

competitive cost.

These series are based on the ARM Cortex -M3 Processor with on-chip Flash memory and SRAM, and has peripheral functions

such as Motor Control Timers, ADCs and Communication Interfaces (USB, UART, CSIO, I C, LIN, Ethernet-MAC).

The products which are described in this data sheet are placed into TYPE2 product categories in "FM3 Family PERIPHERAL

MANUAL".

Features

32-bit ARM Cortex -M3 Core



Processor version: r2p1



Up to 144 MHz Frequency Operation



Memory Protection Unit (MPU): improves the reliability of an

embedded system

External Bus Interface



Supports SRAM, NOR and NAND Flash device



Up to 8 chip selects



8-/16-bit Data width



Up to 25-bit Address bit



Maximum area size: Up to 256 Mbytes



Supports Address/Data multiplex



Supports external RDY input

USB Interface (Max 2 channels)

USB interface is composed of Device and Host.

PLL for USB is built-in, USB clock or Ethernet clock can be

generated by multiplication of Main clock.



Integrated Nested Vectored Interrupt Controller (NVIC): 1

NMI (non-maskable interrupt) and 48 peripheral interrupts

and 16 priority levels



24-bit System timer (Sys Tick): System timer for OS task

management

On-chip Memories

[Flash memory]



Up to 1 Mbyte



Built-in Flash Accelerator System with 16 Kbyte trace buffer

memory

The read access to Flash memory can be achieved without

wait cycle up to operation frequency of 72 MHz. Even at the

operation frequency more than 72 MHz, an equivalent

access to Flash memory can be obtained by Flash

Accelerator System.

[USB device]



USB2.0 Full-Speed supported



Max 6 EndPoint supported



EndPoint



Security function for code protection

[SRAM]

This Series contain a total of up to 128 Kbyte on-chip SRAM.

This is composed of two independent SRAM (SRAM0,

SRAM1). SRAM0 is connected to I-code bus and D-code bus

of Cortex-M3 core. SRAM1 is connected to System bus.

0 is control transfer



EndPoint 1, 2 can be selected Bulk-transfer,

Interrupt-transfer or Isochronous-transfer



EndPoint 3 - 5 can be selected Bulk-transfer or

Interrupt-transfer



EndPoint 1 to 5 is comprised Double Buffer

• EndPoint 0, 2 to 5:64 bytes

• EndPoint 1: 256 bytes

[USB host]



USB2.0 Full/Low speed supported



Bulk-transfer, interrupt-transfer and Isochronous-transfer

support



SRAM0: Up to 64 Kbyte



SRAM1: Up to 64 Kbyte



USB Device connected/dis-connected automatically detect



IN/OUT token handshake packet automatically



Max 256-byte packet-length supported



Wake-up function supported

Cypress Semiconductor Corporation

Document Number: 002-04677 Rev.*C

•

198 Champion Court

•

San Jose

CA 95134-1709

•

408-943-2600

Revised July 11, 2017

MB9B610T Series

Contents

1. Product Lineup .................................................................................................................................................................. 7

2. Packages ........................................................................................................................................................................... 8

3. Pin Assignment ................................................................................................................................................................. 9

4. List of Pin Functions....................................................................................................................................................... 12

5. I/O Circuit Type................................................................................................................................................................ 52

6. Handling Precautions ..................................................................................................................................................... 58

6.1

Precautions for Product Design ................................................................................................................................... 58

6.2

Precautions for Package Mounting .............................................................................................................................. 59

6.3

Precautions for Use Environment ................................................................................................................................ 60

7. Handling Devices ............................................................................................................................................................ 61

8. Block Diagram ................................................................................................................................................................. 63

9. Memory Size .................................................................................................................................................................... 64

10. Memory Map .................................................................................................................................................................... 64

11. Pin Status in Each CPU State ........................................................................................................................................ 67

12. Electrical Characteristics ............................................................................................................................................... 72

12.1 Absolute Maximum Ratings ......................................................................................................................................... 72

12.2 Recommended Operating Conditions.......................................................................................................................... 74

12.3 DC Characteristics....................................................................................................................................................... 76

12.3.1 Current Rating .............................................................................................................................................................. 76

12.3.2 Pin Characteristics ....................................................................................................................................................... 78

12.4 AC Characteristics ....................................................................................................................................................... 80

12.4.1 Main Clock Input Characteristics .................................................................................................................................. 80

12.4.2 Sub Clock Input Characteristics ................................................................................................................................... 81

12.4.3 Internal CR Oscillation Characteristics ......................................................................................................................... 81

12.4.4 Operating Conditions of Main and USB/Ethernet PLL (In the case of using main clock for input of PLL) .................... 82

12.4.5 Operating Conditions of Main PLL (In the case of using high-speed internal CR)........................................................ 82

12.4.6 Reset Input Characteristics .......................................................................................................................................... 83

12.4.7 Power-on Reset Timing................................................................................................................................................ 83

12.4.8 External Bus Timing ..................................................................................................................................................... 84

12.4.9 Base Timer Input Timing .............................................................................................................................................. 94

12.4.10 CSIO/UART Timing .................................................................................................................................................. 95

12.4.11 External Input Timing .............................................................................................................................................. 103

12.4.12 Quadrature Position/Revolution Counter timing ...................................................................................................... 104

12.4.13 I C Timing ............................................................................................................................................................... 106

12.4.14 ETM Timing ............................................................................................................................................................ 107

12.4.15 JTAG Timing ........................................................................................................................................................... 108

12.4.16 Ethernet-MAC Timing ............................................................................................................................................. 109

12.5 12-bit A/D Converter .................................................................................................................................................. 114

12.6 USB characteristics ................................................................................................................................................... 117

12.7 Low-Voltage Detection Characteristics ...................................................................................................................... 121

12.7.1 Low-Voltage Detection Reset ..................................................................................................................................... 121

12.7.2 Interrupt of Low-Voltage Detection ............................................................................................................................. 121

12.8 Flash Memory Write/Erase Characteristics ............................................................................................................... 122

12.8.1 Write / Erase time....................................................................................................................................................... 122

12.8.2 Write cycles and data hold time ................................................................................................................................. 122

12.9 Return Time from Low-Power Consumption Mode .................................................................................................... 123

12.9.1 Return Factor: Interrupt .............................................................................................................................................. 123

Document Number: 002-04677 Rev.*C

Page 5 of 134

MB9BF617TPMC-GK7E1 Related Products

	MB9BF617TPMC-GK7E1	MB9BF617SPMC-GK7E1	MB9BF616TBGL-GK7E1
Description	RISC Microcontroller,	RISC Microcontroller,	RISC Microcontroller,
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
package instruction	LFQFP,	LFQFP,	LFBGA,
Reach Compliance Code	compliant	compliant	compliant
Has ADC	YES	YES	YES
Address bus width	25	19	25
bit size	32	32	32
maximum clock frequency	50 MHz	50 MHz	50 MHz
DAC channel	NO	NO	NO
DMA channel	YES	YES	YES
External data bus width	16	16	16
JESD-30 code	S-PQFP-G176	S-PQFP-G144	S-PBGA-B192
length	24 mm	20 mm	12 mm
Number of I/O lines	154	122	154
Number of terminals	176	144	192
On-chip program ROM width	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFBGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
RAM (bytes)	98304	98304	65536
rom(word)	786432	786432	524288
ROM programmability	FLASH	FLASH	FLASH
Maximum seat height	1.7 mm	1.7 mm	1.45 mm
speed	144 MHz	144 MHz	144 MHz
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.5 mm	0.8 mm
Terminal location	QUAD	QUAD	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	24 mm	20 mm	12 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Maker	Cypress Semiconductor	-	Cypress Semiconductor

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