Bus Transceiver, P Series, 4-Func, 8-Bit, True Output, CMOS
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
package instruction | , |
Reach Compliance Code | compliant |
series | P |
JESD-30 code | R-XZMA-T75 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS TRANSCEIVER |
Number of digits | 8 |
Number of functions | 4 |
Number of ports | 2 |
Number of terminals | 75 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
propagation delay (tpd) | 4.1 ns |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal location | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED |
IDT7MP9244CT | IDT7MP9245CT | IDT7MP9245T | IDT7MP9244T | IDT7MP9245AT | IDT7MP9244AT | |
---|---|---|---|---|---|---|
Description | Bus Transceiver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Transceiver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS | Bus Driver, P Series, 2-Func, 18-Bit, True Output, CMOS | Bus Driver, P Series, 4-Func, 8-Bit, True Output, CMOS |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
series | P | P | P | P | P | P |
JESD-30 code | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 | R-XZMA-T75 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
Number of digits | 8 | 18 | 18 | 8 | 18 | 8 |
Number of functions | 4 | 2 | 2 | 4 | 2 | 4 |
Number of ports | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 75 | 75 | 75 | 75 | 75 | 75 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
propagation delay (tpd) | 4.1 ns | 4.1 ns | 7 ns | 6.5 ns | 4.6 ns | 4.8 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |