|
ATMEGA64L-8AU |
ATMEGA64-16MU |
ATMEGA64L-8MU |
ATMEGA64L-8AQ |
ATMEGA64L-8MQ |
Description |
IC MCU 8BIT 64KB FLASH 64TQFP |
IC MCU 8BIT 64KB FLASH 64QFN |
IC MCU 8BIT 64KB FLASH 64QFN |
IC MCU 8BIT 64KB FLASH 64TQFP |
IC MCU 8BIT 64KB FLASH 64QFN |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Microchip |
Microchip |
Microchip |
Microchip |
Microchip |
Reach Compliance Code |
compliant |
compli |
compliant |
compliant |
compliant |
Factory Lead Time |
10 weeks |
7 weeks |
6 weeks |
7 weeks |
7 weeks |
bit size |
8 |
8 |
8 |
8 |
8 |
CPU series |
AVR RISC |
AVR RISC |
AVR RISC |
AVR RISC |
AVR RISC |
JESD-30 code |
S-PQFP-G64 |
S-XQCC-N64 |
S-XQCC-N64 |
S-PQFP-G64 |
S-PQCC-N64 |
Number of terminals |
64 |
64 |
64 |
64 |
64 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
105 °C |
105 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
UNSPECIFIED |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TQFP |
HVQCCN |
HVQCCN |
QFP |
QCCN |
Encapsulate equivalent code |
LCC64,.35SQ,20 |
LCC64,.35SQ,20 |
LCC64,.35SQ,20 |
TQFP64,.63SQ,32 |
LCC64,.35SQ,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
FLATPACK, THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
FLATPACK |
CHIP CARRIER |
power supply |
3/5 V |
5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (bytes) |
4096 |
4096 |
4096 |
4096 |
4096 |
rom(word) |
32768 |
32768 |
32768 |
32768 |
32768 |
ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
FLASH |
speed |
8 MHz |
16 MHz |
8 MHz |
8 MHz |
8 MHz |
Maximum slew rate |
5 mA |
20 mA |
5 mA |
20 mA |
20 mA |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
NO LEAD |
NO LEAD |
GULL WING |
NO LEAD |
Terminal pitch |
0.8 mm |
0.5 mm |
0.5 mm |
0.8 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
package instruction |
TQFP, LCC64,.35SQ,20 |
MLF-64 |
HVQCCN, LCC64,.35SQ,20 |
- |
QCCN, LCC64,.35SQ,20 |
Has ADC |
YES |
YES |
YES |
- |
- |
Address bus width |
16 |
16 |
16 |
- |
- |
maximum clock frequency |
8 MHz |
16 MHz |
8 MHz |
- |
- |
DAC channel |
NO |
NO |
NO |
- |
- |
DMA channel |
NO |
NO |
NO |
- |
- |
External data bus width |
8 |
8 |
8 |
- |
- |
JESD-609 code |
e3 |
e3 |
e3 |
- |
- |
length |
14 mm |
9 mm |
9 mm |
- |
- |
Humidity sensitivity level |
3 |
3 |
3 |
- |
- |
Number of I/O lines |
53 |
53 |
53 |
- |
- |
PWM channel |
YES |
YES |
YES |
- |
- |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
- |
- |
Maximum seat height |
1.2 mm |
1 mm |
1 mm |
- |
- |
Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
- |
- |
Minimum supply voltage |
2.7 V |
4.5 V |
2.7 V |
- |
- |
Nominal supply voltage |
3 V |
5 V |
3 V |
- |
- |
Terminal surface |
Matte Tin (Sn) |
MATTE TIN |
MATTE TIN |
- |
- |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
- |
- |
width |
14 mm |
9 mm |
9 mm |
- |
- |