256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Microchip |
| Parts packaging code | SON |
| package instruction | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| Spare memory width | 8 |
| Maximum clock frequency (fCLK) | 3 MHz |
| JESD-30 code | R-PDSO-N8 |
| JESD-609 code | e3 |
| length | 3 mm |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256X16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Serial bus type | MICROWIRE |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | MATTE TIN |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 2 mm |
| Maximum write cycle time (tWC) | 6 ms |
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