AM3P-67202AL-25 datasheet, PDF

AM3P-67202AL-25: DescriptionFIFO, 1KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size181KB，17 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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AM3P-67202AL-25 Overview

FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	TEMIC
package instruction	0.300 INCH, PLASTIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	25 ns
Maximum clock frequency (fCLK)	28.57 MHz
period time	35 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
memory density	9216 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	1KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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