AT25HP512CI-10CI-1.8 datasheet, PDF

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AT25HP512CI-10CI-1.8: DescriptionEEPROM, 64KX8, Serial, CMOS, 8 X 5 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8; Categorystorage storage; File Size220KB，21 Pages; ManufacturerAtmel (Microchip)

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AT25HP512CI-10CI-1.8 Overview

EEPROM, 64KX8, Serial, CMOS, 8 X 5 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8

AT25HP512CI-10CI-1.8 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Parts packaging code	SOIC
package instruction	SON, SOLCC8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	2 MHz
Data retention time - minimum	40
Durability	100000 Write/Erase Cycles
JESD-30 code	R-XDSO-N8
JESD-609 code	e0
length	8 mm
memory density	524288 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Package body material	UNSPECIFIED
encapsulated code	SON
Encapsulate equivalent code	SOLCC8,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	240
power supply	2/5 V
Certification status	Not Qualified
Serial bus type	SPI
Maximum standby current	0.000002 A
Maximum slew rate	0.01 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5 mm
Maximum write cycle time (tWC)	10 ms
write protect	HARDWARE/SOFTWARE

AT25HP512CI-10CI-1.8 Related Products

	AT25HP512CI-10CI-1.8	AT25HP512CI-10CI-2.7
Description	EEPROM, 64KX8, Serial, CMOS, 8 X 5 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8	EEPROM, 64KX8, Serial, CMOS, 8 X 5 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Parts packaging code	SOIC	SOIC
package instruction	SON, SOLCC8,.3	SON, SOLCC8,.3
Contacts	8	8
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	EAR99
Maximum clock frequency (fCLK)	2 MHz	5 MHz
Data retention time - minimum	40	40
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-XDSO-N8	R-XDSO-N8
JESD-609 code	e0	e0
length	8 mm	8 mm
memory density	524288 bit	524288 bit
Memory IC Type	EEPROM	EEPROM
memory width	8	8
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	8	8
word count	65536 words	65536 words
character code	64000	64000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	64KX8	64KX8
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	SON	SON
Encapsulate equivalent code	SOLCC8,.3	SOLCC8,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	240	240
power supply	2/5 V	3/5 V
Certification status	Not Qualified	Not Qualified
Serial bus type	SPI	SPI
Maximum standby current	0.000002 A	0.000002 A
Maximum slew rate	0.01 mA	0.01 mA
Maximum supply voltage (Vsup)	3.6 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	2.7 V
Nominal supply voltage (Vsup)	2.7 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
width	5 mm	5 mm
Maximum write cycle time (tWC)	10 ms	10 ms
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE

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