MASK ROM, 512KX8, 200ns, CMOS, PDSO32, PLASTIC, SOP-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP32,.56 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| length | 20.45 mm |
| memory density | 4194304 bit |
| Memory IC Type | MASK ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP32,.56 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.05 mm |
| Maximum standby current | 0.00003 A |
| Maximum slew rate | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| HN62315BF-20 | HN62315BP-15 | HN62315BTT-15 | HN62315BP-20 | HN62315BF-15 | HN62315BTT-20 | |
|---|---|---|---|---|---|---|
| Description | MASK ROM, 512KX8, 200ns, CMOS, PDSO32, PLASTIC, SOP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDSO32, PLASTIC, TSOP2-32 | MASK ROM, 512KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 | MASK ROM, 512KX8, 150ns, CMOS, PDSO32, PLASTIC, SOP-32 | MASK ROM, 512KX8, 200ns, CMOS, PDSO32, PLASTIC, TSOP2-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOIC | DIP | TSOP2 | DIP | SOIC | TSOP2 |
| package instruction | SOP, SOP32,.56 | DIP, DIP32,.6 | TSOP2, TSOP32,.46 | DIP, DIP32,.6 | SOP, SOP32,.56 | TSOP2, TSOP32,.46 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 150 ns | 150 ns | 200 ns | 150 ns | 200 ns |
| JESD-30 code | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 20.45 mm | 41.9 mm | 20.95 mm | 41.9 mm | 20.45 mm | 20.95 mm |
| memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| character code | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | TSOP2 | DIP | SOP | TSOP2 |
| Encapsulate equivalent code | SOP32,.56 | DIP32,.6 | TSOP32,.46 | DIP32,.6 | SOP32,.56 | TSOP32,.46 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.05 mm | 5.08 mm | 1.2 mm | 5.08 mm | 3.05 mm | 1.2 mm |
| Maximum standby current | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A | 0.00003 A |
| Maximum slew rate | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Hitachi （Renesas ） | - | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| width | - | 15.24 mm | 10.16 mm | 15.24 mm | - | 10.16 mm |
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