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GD74HCT155J

Description
Decoder/Driver, CMOS, CDIP16,
Categorylogic    logic   
File Size191KB,4 Pages
ManufacturerLG Semicon Co., Ltd.
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GD74HCT155J Overview

Decoder/Driver, CMOS, CDIP16,

GD74HCT155J Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLG Semicon Co., Ltd.
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeOTHER DECODER/DRIVER
MaximumI(ol)0.004 A
Number of functions2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Prop。Delay @ Nom-Sup52 ns
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

GD74HCT155J Related Products

GD74HCT155J GD54HCT155J GD54HC155J GD74HC155J GD74HC155D GD74HC155 GD74HCT155 GD74HCT155D
Description Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, CDIP16, Decoder/Driver, CMOS, PDSO16, Decoder/Driver, CMOS, PDIP16, Decoder/Driver, CMOS, PDIP16, Decoder/Driver, CMOS, PDSO16,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 SOP, SOP16,.25 DIP, DIP16,.3 DIP, DIP16,.3 SOP, SOP16,.25
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Maker LG Semicon Co., Ltd. LG Semicon Co., Ltd. - LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd. LG Semicon Co., Ltd.
JESD-30 code R-XDIP-T16 - R-XDIP-T16 R-XDIP-T16 R-PDSO-G16 R-PDIP-T16 R-PDIP-T16 R-PDSO-G16
JESD-609 code e0 - e0 e0 e0 e0 e0 e0
Load capacitance (CL) 50 pF - 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type OTHER DECODER/DRIVER - OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
MaximumI(ol) 0.004 A - 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Number of functions 2 - 2 2 2 2 2 2
Number of terminals 16 - 16 16 16 16 16 16
Maximum operating temperature 85 °C - 125 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C - -55 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material CERAMIC - CERAMIC CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP - DIP DIP SOP DIP DIP SOP
Encapsulate equivalent code DIP16,.3 - DIP16,.3 DIP16,.3 SOP16,.25 DIP16,.3 DIP16,.3 SOP16,.25
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE - IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE
power supply 5 V - 2/6 V 2/6 V 2/6 V 2/6 V 5 V 5 V
Prop。Delay @ Nom-Sup 52 ns - 55 ns 48 ns 48 ns 48 ns 52 ns 52 ns
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO - NO NO YES NO NO YES
technology CMOS - CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE - THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 2.54 mm - 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL - DUAL DUAL DUAL DUAL DUAL DUAL

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