IDT72T51258L6-7BB datasheet, PDF

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IDT72T51258L6-7BB: DescriptionFIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324; Categorystorage storage; File Size513KB，56 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT72T51258L6-7BB Overview

FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

IDT72T51258L6-7BB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
Contacts	324
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	3.8 ns
Maximum clock frequency (fCLK)	150 MHz
period time	6.7 ns
JESD-30 code	S-PBGA-B324
JESD-609 code	e0
length	19 mm
memory density	2621440 bit
Memory IC Type	OTHER FIFO
memory width	40
Humidity sensitivity level	3
Number of functions	1
Number of terminals	324
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX40
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA324,18X18,40
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	1.5/2.5,2.5 V
Certification status	Not Qualified
Maximum seat height	1.97 mm
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	19 mm

IDT72T51258L6-7BB Related Products

	IDT72T51258L6-7BB	IDT72T51248L6-7BBI	IDT72T51248L6-7BB	IDT72T51258L5BB	IDT72T51248L5BB	IDT72T51258L6-7BBI
Description	FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 32KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 32KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 64KX40, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 32KX40, 3.6ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	FIFO, 64KX40, 3.8ns, Synchronous, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324	19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
Contacts	324	324	324	324	324	324
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	3.8 ns	3.8 ns	3.8 ns	3.6 ns	3.6 ns	3.8 ns
Maximum clock frequency (fCLK)	150 MHz	150 MHz	150 MHz	200 MHz	200 MHz	150 MHz
period time	6.7 ns	6.7 ns	6.7 ns	5 ns	5 ns	6.7 ns
JESD-30 code	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324
JESD-609 code	e0	e0	e0	e0	e0	e0
length	19 mm	19 mm	19 mm	19 mm	19 mm	19 mm
memory density	2621440 bit	1310720 bit	1310720 bit	2621440 bit	1310720 bit	2621440 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	40	40	40	40	40	40
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of terminals	324	324	324	324	324	324
word count	65536 words	32768 words	32768 words	65536 words	32768 words	65536 words
character code	64000	32000	32000	64000	32000	64000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C
organize	64KX40	32KX40	32KX40	64KX40	32KX40	64KX40
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
power supply	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V	1.5/2.5,2.5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.97 mm	1.97 mm	1.97 mm	1.97 mm	1.97 mm	1.97 mm
Maximum supply voltage (Vsup)	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V	2.625 V
Minimum supply voltage (Vsup)	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V	2.375 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30
width	19 mm	19 mm	19 mm	19 mm	19 mm	19 mm
Base Number Matches	-	1	1	1	1	-

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