|
HEF4051BTS,118 |
HEF4051BT/N,118 |
HEF4051BT,013 |
HEF4051BT,652 |
HEF4051BT,653 |
Description |
8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16 |
8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16 |
8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16 |
8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16 |
8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
Maximum operating temperature |
85 °C |
85 Cel |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
surface mount |
YES |
Yes |
YES |
YES |
YES |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Brand Name |
NXP Semiconductor |
- |
NXP Semiconductor |
NXP Semiconduc |
NXP Semiconductor |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
conform to |
Maker |
NXP |
- |
NXP |
NXP |
NXP |
Parts packaging code |
SSOP1 |
- |
SOP |
SOP |
SOP |
package instruction |
5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 |
- |
SOP, SOP16,.25 |
PLASTIC, SO-16 |
PLASTIC, SO-16 |
Contacts |
16 |
- |
16 |
16 |
16 |
Manufacturer packaging code |
SOT338-1 |
- |
SOT109-1 |
SOT109-1 |
SOT109-1 |
Reach Compliance Code |
compliant |
- |
compliant |
compli |
compliant |
Analog Integrated Circuits - Other Types |
SINGLE-ENDED MULTIPLEXER |
- |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
JESD-30 code |
R-PDSO-G16 |
- |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e4 |
- |
e4 |
e4 |
e4 |
length |
6.2 mm |
- |
9.9 mm |
9.9 mm |
9.9 mm |
Humidity sensitivity level |
1 |
- |
1 |
1 |
1 |
Number of channels |
8 |
- |
8 |
8 |
8 |
Nominal off-state isolation |
50 dB |
- |
50 dB |
50 dB |
50 dB |
On-state resistance matching specifications |
5 Ω |
- |
5 Ω |
5 Ω |
5 Ω |
Maximum on-state resistance (Ron) |
175 Ω |
- |
175 Ω |
175 Ω |
175 Ω |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SSOP |
- |
SOP |
SOP |
SOP |
Encapsulate equivalent code |
SSOP16,.3 |
- |
SOP16,.25 |
SOP16,.25 |
SOP16,.25 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, SHRINK PITCH |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
260 |
260 |
power supply |
5/15 V |
- |
5/15 V |
5/15 V |
5/15 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
2 mm |
- |
1.75 mm |
1.75 mm |
1.75 mm |
Maximum signal current |
0.01 A |
- |
0.01 A |
0.01 A |
0.01 A |
Maximum supply current (Isup) |
0.6 mA |
- |
0.6 mA |
0.6 mA |
0.6 mA |
Maximum supply voltage (Vsup) |
15 V |
- |
15 V |
15 V |
15 V |
Minimum supply voltage (Vsup) |
3 V |
- |
3 V |
3 V |
3 V |
Nominal supply voltage (Vsup) |
15 V |
- |
15 V |
15 V |
15 V |
Maximum disconnect time |
230 ns |
- |
230 ns |
230 ns |
230 ns |
Maximum connection time |
80 ns |
- |
80 ns |
80 ns |
80 ns |
switch |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Terminal surface |
NICKEL PALLADIUM GOLD |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NICKEL PALLADIUM GOLD |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal pitch |
0.65 mm |
- |
1.27 mm |
1.27 mm |
1.27 mm |
Maximum time at peak reflow temperature |
30 |
- |
30 |
30 |
30 |
width |
5.3 mm |
- |
3.9 mm |
3.9 mm |
3.9 mm |
Base Number Matches |
1 |
- |
1 |
- |
1 |