IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC
Parameter Name | Attribute value |
Maker | Seiko Epson Corporation |
Parts packaging code | QFP |
package instruction | LQFP, QFP64,.66SQ,32 |
Contacts | 64 |
Reach Compliance Code | unknown |
Has ADC | NO |
Address bus width | 8 |
bit size | 4 |
CPU series | E0C6200/SMC6200 |
DAC channel | NO |
DMA channel | NO |
External data bus width | 4 |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e0 |
Negative supply voltage rating | -3 V |
Number of I/O lines | 4 |
Number of terminals | 64 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -20 °C |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP64,.66SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
power supply | -3 V |
Certification status | Not Qualified |
RAM (bytes) | 40 |
rom(word) | 1024 |
ROM programmability | MROM |
speed | 0.08 MHz |
Maximum supply voltage | 3.5 V |
Minimum supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULLWING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
SMC6251F6-64 | SMC62L51F6-60 | SMC6251F6-60 | |
---|---|---|---|
Description | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,60PIN,CERAMIC | IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,60PIN,CERAMIC |
Maker | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
Parts packaging code | QFP | QFP | QFP |
package instruction | LQFP, QFP64,.66SQ,32 | LQFP, QFP60,.7SQ,32 | LQFP, QFP60,.7SQ,32 |
Contacts | 64 | 60 | 60 |
Reach Compliance Code | unknown | unknown | unknown |
Has ADC | NO | NO | NO |
Address bus width | 8 | 8 | 8 |
bit size | 4 | 4 | 4 |
CPU series | E0C6200/SMC6200 | E0C6200/SMC6200 | E0C6200/SMC6200 |
DAC channel | NO | NO | NO |
DMA channel | NO | NO | NO |
External data bus width | 4 | 4 | 4 |
JESD-30 code | S-PQFP-G64 | S-XQFP-G60 | S-XQFP-G60 |
JESD-609 code | e0 | e0 | e0 |
Negative supply voltage rating | -3 V | -1.5 V | -3 V |
Number of I/O lines | 4 | 4 | 4 |
Number of terminals | 64 | 60 | 60 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C |
PWM channel | NO | NO | NO |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC |
encapsulated code | LQFP | LQFP | LQFP |
Encapsulate equivalent code | QFP64,.66SQ,32 | QFP60,.7SQ,32 | QFP60,.7SQ,32 |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
power supply | -3 V | -1.5 V | -3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
RAM (bytes) | 40 | 40 | 40 |
rom(word) | 1024 | 1024 | 1024 |
ROM programmability | MROM | MROM | MROM |
speed | 0.08 MHz | 0.08 MHz | 0.08 MHz |
Maximum supply voltage | 3.5 V | 2 V | 3.5 V |
Minimum supply voltage | 1.8 V | 0.9 V | 1.8 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULLWING | GULLWING | GULLWING |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | QUAD | QUAD | QUAD |