N-channel TrenchMOS logic level FET
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconduc |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | TO-262 |
| package instruction | PLASTIC, TO-262, I2PAK-3 |
| Contacts | 3 |
| Manufacturer packaging code | SOT226 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Avalanche Energy Efficiency Rating (Eas) | 1300 mJ |
| Shell connection | DRAIN |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 30 V |
| Maximum drain current (Abs) (ID) | 75 A |
| Maximum drain current (ID) | 75 A |
| Maximum drain-source on-resistance | 0.0044 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code | TO-262AA |
| JESD-30 code | R-PSIP-T3 |
| JESD-609 code | e3 |
| Number of components | 1 |
| Number of terminals | 3 |
| Operating mode | ENHANCEMENT MODE |
| Maximum operating temperature | 175 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Maximum power dissipation(Abs) | 254 W |
| Maximum pulsed drain current (IDM) | 732 A |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal surface | Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
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