TBP28S86AMJW datasheet, PDF - EEWORLD Datasheet

TBP28S86AMJW: Description1KX8 OTPROM, 80ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24; Categorystorage storage; File Size1MB，24 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TBP28S86AMJW Overview

1KX8 OTPROM, 80ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	80 ns
JESD-30 code	R-GDIP-T24
length	32.07 mm
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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