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GS8644ZV36GB-200T

Description
ZBT SRAM, 2MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FBGA-119
Categorystorage    storage   
File Size1MB,37 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance  
Download Datasheet Parametric View All

GS8644ZV36GB-200T Overview

ZBT SRAM, 2MX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FBGA-119

GS8644ZV36GB-200T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time6.5 ns
Other featuresPIPELINED OR FLOW-THROUGH ARCHITECTURE
JESD-30 codeR-PBGA-B119
JESD-609 codee1
length22 mm
memory density75497472 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX36
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.99 mm
Maximum supply voltage (Vsup)2 V
Minimum supply voltage (Vsup)1.6 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Product Preview
GS8644ZV18(B/E)/GS8644ZV36(B/E)/GS8644ZV72(C)
119-, 165-, & 209-Pin BGA
Commercial Temp
Industrial Temp
Features
• NBT (No Bus Turn Around) functionality allows zero wait
Read-Write-Read bus utilization; fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 1.8 V +10%/–10% core power supply and I/O supply
• User-configurable Pipeline and Flow Through mode
• ZQ mode pin for user-selectable high/low output drive
• IEEE 1149.1 JTAG-compatible Boundary Scan
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2Mb, 4Mb, 9Mb, 18Mb, and 36Mb
devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 119-, 165- or 209-bump BGA package
72Mb Pipelined and Flow Through
Synchronous NBT SRAM
250 MHz–133MHz
1.8 V V
DD
1.8 V I/O
Because it is a synchronous device, address, data inputs, and
read/write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8644ZV18/36/72 may be configured by the user to
operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, in addition to the rising-edge-
triggered registers that capture input signals, the device
incorporates a rising edge triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge-triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS8644ZV18/36/72 is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
standard 119-bump, 165-bump or 209-bump BGA package.
Functional Description
The GS8644ZV18/36/72 is a 72Mbit Synchronous Static
SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or
other pipelined read/double late write or flow through read/
single late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Parameter Synopsis
t
KQ(x18/x36)
t
KQ(x72)
tCycle
Curr
(x18)
Curr
(x36)
Curr
(x72)
t
KQ
tCycle
Curr
(x18)
Curr
(x36)
Curr
(x72)
-250 -225 -200
2.3 2.5 2.7
2.6 2.7 2.8
4.0 4.4 5.0
385
450
540
6.5
6.5
265
290
345
-166
2.9
2.9
6.0
-150
3.3
3.3
6.7
-133 Unit
3.5 ns
3.5 ns
7.5 ns
Pipeline
3-1-1-1
360 335 305 295 265 mA
415 385 345 325 295 mA
505 460 405 385 345 mA
6.5
6.5
6.5
6.5
8.0
8.0
8.5
8.5
8.5
8.5
ns
ns
Flow
Through
2-1-1-1
265 265 255 240 225 mA
290 290 280 265 245 mA
345 345 335 315 300 mA
Rev: 1.03 11/2004
1/37
© 2003, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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