CXK58257AM-12LB datasheet, PDF

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CXK58257AM-12LB: DescriptionStandard SRAM, 32KX8, 120ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28; Categorystorage storage; File Size216KB，9 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp

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CXK58257AM-12LB Overview

Standard SRAM, 32KX8, 120ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28

CXK58257AM-12LB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SONY
Parts packaging code	SOIC
package instruction	SOP, SOP28,.5
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	120 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	18 mm
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP28,.5
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	2.7 mm
Maximum standby current	0.000002 A
Minimum standby current	2 V
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.4 mm

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CXK58257AM-12LB Related Products

	CXK58257AM-12LB	CXK58257AP-12LB
Description	Standard SRAM, 32KX8, 120ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28	Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	SONY	SONY
Parts packaging code	SOIC	DIP
package instruction	SOP, SOP28,.5	DIP, DIP28,.6
Contacts	28	28
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	120 ns	120 ns
I/O type	COMMON	COMMON
JESD-30 code	R-PDSO-G28	R-PDIP-T28
JESD-609 code	e0	e0
length	18 mm	36.8 mm
memory density	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	8	8
Number of functions	1	1
Number of ports	1	1
Number of terminals	28	28
word count	32768 words	32768 words
character code	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32KX8	32KX8
Output characteristics	3-STATE	3-STATE
Exportable	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP
Encapsulate equivalent code	SOP28,.5	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.7 mm	5 mm
Maximum standby current	0.000002 A	0.000002 A
Minimum standby current	2 V	2 V
Maximum slew rate	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	8.4 mm	15.24 mm

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