2A, 150V, NPN, Si, POWER TRANSISTOR, TO-213AA, HERMETIC SEALED, METAL, TO-66, 2 PIN
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | SEMELAB |
Parts packaging code | TO-66 |
package instruction | FLANGE MOUNT, O-MBFM-P2 |
Contacts | 2 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Shell connection | COLLECTOR |
Maximum collector current (IC) | 2 A |
Collector-emitter maximum voltage | 150 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 10 |
JEDEC-95 code | TO-213AA |
JESD-30 code | O-MBFM-P2 |
JESD-609 code | e1 |
Number of components | 1 |
Number of terminals | 2 |
Package body material | METAL |
Package shape | ROUND |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | TIN SILVER COPPER |
Terminal form | PIN/PEG |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Transistor component materials | SILICON |
Nominal transition frequency (fT) | 20 MHz |
BUX67R1 | BUX67.MODR1 | BUX67.MOD | |
---|---|---|---|
Description | 2A, 150V, NPN, Si, POWER TRANSISTOR, TO-213AA, HERMETIC SEALED, METAL, TO-66, 2 PIN | 2A, 150V, NPN, Si, POWER TRANSISTOR, TO-213AA, HERMETIC SEALED, METAL, TO-66, 2 PIN | 2A, 150V, NPN, Si, POWER TRANSISTOR, TO-213AA, HERMETIC SEALED, METAL, TO-66, 2 PIN |
Is it lead-free? | Lead free | Lead free | Contains lead |
Is it Rohs certified? | conform to | conform to | incompatible |
Parts packaging code | TO-66 | TO-66 | TO-66 |
package instruction | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 |
Contacts | 2 | 2 | 2 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
Shell connection | COLLECTOR | COLLECTOR | COLLECTOR |
Maximum collector current (IC) | 2 A | 2 A | 2 A |
Collector-emitter maximum voltage | 150 V | 150 V | 150 V |
Configuration | SINGLE | SINGLE | SINGLE |
Minimum DC current gain (hFE) | 10 | 10 | 10 |
JEDEC-95 code | TO-213AA | TO-213AA | TO-213AA |
JESD-30 code | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 |
Number of components | 1 | 1 | 1 |
Number of terminals | 2 | 2 | 2 |
Package body material | METAL | METAL | METAL |
Package shape | ROUND | ROUND | ROUND |
Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | NPN | NPN | NPN |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Transistor component materials | SILICON | SILICON | SILICON |
Nominal transition frequency (fT) | 20 MHz | 20 MHz | 20 MHz |
Maker | SEMELAB | - | SEMELAB |
JESD-609 code | e1 | e1 | - |
Terminal surface | TIN SILVER COPPER | TIN SILVER COPPER | - |