TC58FVT160AXG-10 datasheet, PDF

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TC58FVT160AXG-10: DescriptionIC 1M X 16 FLASH 3V PROM, 100 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Programmable ROM; Categorystorage storage; File Size398KB，42 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TC58FVT160AXG-10 Overview

IC 1M X 16 FLASH 3V PROM, 100 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Programmable ROM

TC58FVT160AXG-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Toshiba Semiconductor
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
Spare memory width	8
startup block	TOP
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	6 mm

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TC58FVT160/B160ATG/AXG-70,-10

TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS

16-MBIT (2M

8 BITS / 1M

16 BITS) CMOS FLASH MEMORY

DESCRIPTION

Lead-Free

The TC58FVT160/B160A is a 16,777,216-bit, 3.0-V read-only electrically erasable and programmable flash

memory organized as 2,097,152 words

8 bits or as 1,048,576 words

16 bits. The TC58FVT160/B160A features

commands for Read, Program and Erase operations to allow easy interfacing with microprocessors. The commands

are based on the JEDEC standard. The Program and Erase operations are automatically executed in the chip.

FEATURES

•

Power supply voltage

2.7 V~3.6 V

Operating temperature

= −40°C~85°C

Organization

8 bits / 1M

16 bits

Functions

Auto Program, Auto Erase

Fast Program Mode

Program Suspend/Resume

Erase Suspend/Resume

Data Polling/Toggle Bit

Block Protection

Automatic Sleep, Support for Hidden ROM Area

Common Flash Memory Interface (CFI)

Byte/Word Modes

•

Block erase architecture

16 Kbytes / 2

8 Kbytes

32 Kbytes / 31

64 Kbytes

Boot block architecture

TC58FVT160ATG/AXG: top boot block

TC58FVB160ATG/AXG: bottom boot block

Mode control

Compatible with JEDEC standard commands

Erase/Program cycles

cycles typ.

Access time

70 ns

: 30 pF)

100 ns

: 100 pF)

Power consumption

µA

(Standby)

30 mA

(Read operation)

15 mA

(Program/Erase operations)

Package

TC58FVT160/B160ATG:

TSOPI48-P-1220-0.50 (weight: 0.51 g)

TC58FVT160/B160AXG:

P-TFBGA48-0608-0.80AZ (weight: 0.090 g)

Lead-Free

•

2004-09-01

1/42

TC58FVT160AXG-10 Related Products

	TC58FVT160AXG-10	TC58FVB160ATG-10	TC58FVB160AXG-10	TC58FVB160AXG-70	TC58FVB160ATG-70	TC58FVT160ATG-10	TC58FVT160AXG-70	TC58FVT160ATG-70
Description	IC 1M X 16 FLASH 3V PROM, 100 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 100 ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 100 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 70 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 70 ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 100 ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 70 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Programmable ROM	IC 1M X 16 FLASH 3V PROM, 70 ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Programmable ROM
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	TSOP1	BGA	BGA	TSOP1	TSOP1	BGA	TSOP1
package instruction	TFBGA,	TSOP1,	TFBGA,	TFBGA,	12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48	TSOP1,	TFBGA,	12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Contacts	48	48	48	48	48	48	48	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	100 ns	100 ns	70 ns	70 ns	100 ns	70 ns	70 ns
Spare memory width	8	8	8	8	8	8	8	8
startup block	TOP	BOTTOM	BOTTOM	BOTTOM	BOTTOM	TOP	TOP	TOP
JESD-30 code	R-PBGA-B48	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48	R-PDSO-G48	R-PBGA-B48	R-PDSO-G48
length	8 mm	18.4 mm	8 mm	8 mm	18.4 mm	18.4 mm	8 mm	18.4 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	48	48	48	48	48	48	48	48
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP1	TFBGA	TFBGA	TSOP1	TSOP1	TFBGA	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	BALL	GULL WING
Terminal pitch	0.8 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm
Terminal location	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	6 mm	12 mm	6 mm	6 mm	12 mm	12 mm	6 mm	12 mm
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free	-

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