Flash Module, 2MX8, 200ns,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Twilight Technology Inc. |
package instruction | DIP, DIP50,1.2 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 200 ns |
Other features | CONFIGURABLE AS 4096K X 8 OR 2048K X 16 BY SUITABLE EXTERNAL CONNECTION |
Data polling | NO |
JESD-30 code | R-XDMA-T50 |
memory density | 16777216 bit |
Memory IC Type | FLASH MODULE |
memory width | 8 |
Number of functions | 2 |
Number of terminals | 50 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX8 |
Package body material | UNSPECIFIED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP50,1.2 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 12 V |
Certification status | Not Qualified |
Maximum standby current | 0.0016 A |
Maximum slew rate | 0.075 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
type | NOR TYPE |