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DPZ128X32IV3-25I

Description
Flash Module, 128KX32, 250ns, CERAMIC, MODULE, SLCC, PGA-66
Categorystorage    storage   
File Size875KB,14 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DPZ128X32IV3-25I Overview

Flash Module, 128KX32, 250ns, CERAMIC, MODULE, SLCC, PGA-66

DPZ128X32IV3-25I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codePGA
package instructionAPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time250 ns
Spare memory width16
Data pollingNO
JESD-30 codeS-XPGA-P66
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX32
Package body materialUNSPECIFIED
encapsulated codeAPGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY, PIGGYBACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height4.1402 mm
Maximum standby current0.0004 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelINDUSTRIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
4 Megabit FLASH EEPROM
DPZ128X32IV3
DESCRIPTION:
The DPZ128X32IV3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers
4 Megabits of FLASH EEPROM in a single package
envelope of 1.090" x 1.090" x .163".
The DPZ128X32IV3 is built with two SLCC packages
each containing two 128K x 8 FLASH memory devices.
Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules
offers a higher board density of memory than available
with conventional through-hole, surface mount, module
or hybrid techniques.
FEATURES:
Organization:
128K x 32, 256K x 16
Fast Access Times (max.):
120, 150, 170, 200, 250ns
Fully Static Operation
- No clock or refresh required
TTL Compatible Inputs
and Outputs
Common Data Inputs
and Outputs
10,000 Erase/Program
Cycles (min.)
66 - Pin PGA ‘’VERSA-STACK’’
Package
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
I/O0 - I/O31
CE0, CE1
WE0, WE1
OE
V
PP
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Chip Enables
Write Enables
Output Enable
Programming
Voltage (+12.0V)
Power (+5V)
Ground
No Connect
30A072-10
REV. A
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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