Magnetic Sensor, 1 Func, CMOS, PDSO4, PLASTIC, SOT-89B-3, SMD-4
| Parameter Name | Attribute value |
| Maker | TDK Corporation |
| package instruction | PLASTIC, SOT-89B-3, SMD-4 |
| Reach Compliance Code | compliant |
| Analog Integrated Circuits - Other Types | MAGNETIC SENSOR |
| JESD-30 code | R-PDSO-G4 |
| length | 4.55 mm |
| Number of functions | 1 |
| Number of terminals | 4 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE |
| Certification status | Not Qualified |
| Maximum seat height | 1.3 mm |
| Maximum supply voltage (Vsup) | 24 V |
| Minimum supply voltage (Vsup) | 3.8 V |
| Nominal supply voltage (Vsup) | 12 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | GULL WING |
| Terminal pitch | 1.5 mm |
| Terminal location | DUAL |
| width | 2.55 mm |
| HAL109TQ-I | HAL101TQ-I | HAL102TQ-I | HAL109JQ-I | HAL101JQ-I | |
|---|---|---|---|---|---|
| Description | Magnetic Sensor, 1 Func, CMOS, PDSO4, PLASTIC, SOT-89B-3, SMD-4 | Magnetic Sensor, 1 Func, CMOS, PDSO4, PLASTIC, SOT-89B-3, SMD-4 | Magnetic Sensor, 1 Func, CMOS, PDSO4, PLASTIC, SOT-89B-3, SMD-4 | Magnetic Sensor, 1 Func, CMOS, PSIP3, PLASTIC, TO-92UA-6, SMD-3 | Magnetic Sensor, 1 Func, CMOS, PSIP3, PLASTIC, TO-92UA-6, SMD-3 |
| package instruction | PLASTIC, SOT-89B-3, SMD-4 | PLASTIC, SOT-89B-3, SMD-4 | PLASTIC, SOT-89B-3, SMD-4 | PLASTIC, TO-92UA-6, SMD-3 | PLASTIC, TO-92UA-6, SMD-3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| Analog Integrated Circuits - Other Types | MAGNETIC SENSOR | MAGNETIC SENSOR | MAGNETIC SENSOR | MAGNETIC SENSOR | MAGNETIC SENSOR |
| JESD-30 code | R-PDSO-G4 | R-PDSO-G4 | R-PDSO-G4 | R-PSIP-T3 | R-PSIP-T3 |
| length | 4.55 mm | 4.55 mm | 4.55 mm | 4.06 mm | 4.06 mm |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 4 | 4 | 4 | 3 | 3 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LSOP | LSOP | LSOP | SIP | SIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.3 mm | 1.3 mm | 1.3 mm | 4.3 mm | 4.3 mm |
| Maximum supply voltage (Vsup) | 24 V | 24 V | 24 V | 24 V | 24 V |
| Minimum supply voltage (Vsup) | 3.8 V | 3.8 V | 3.8 V | 3.8 V | 3.8 V |
| Nominal supply voltage (Vsup) | 12 V | 12 V | 12 V | 12 V | 12 V |
| surface mount | YES | YES | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | OTHER | OTHER | OTHER | OTHER |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.5 mm | 1.5 mm | 1.5 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | SINGLE | SINGLE |
| width | 2.55 mm | 2.55 mm | 2.55 mm | 1.5 mm | 1.5 mm |
| Maker | TDK Corporation | - | - | TDK Corporation | TDK Corporation |
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