Microprocessor, 16-Bit, 20MHz, CMOS, PQFP100, EIAJ, QFP-100
Parameter Name | Attribute value |
Maker | Rochester Electronics |
package instruction | EIAJ, QFP-100 |
Reach Compliance Code | unknown |
ECCN code | 3A991.A.2 |
Other features | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE; NUMERIC COPROCESSOR INTERFACE |
Address bus width | 20 |
bit size | 16 |
boundary scan | NO |
maximum clock frequency | 40 MHz |
External data bus width | 16 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | R-PQFP-G100 |
length | 20 mm |
low power mode | YES |
Number of terminals | 100 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Maximum seat height | 3.15 mm |
speed | 20 MHz |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
width | 14 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
TS80C186EC20 | TS80C186EC13 | SB80C186EC-13 | |
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Description | Microprocessor, 16-Bit, 20MHz, CMOS, PQFP100, EIAJ, QFP-100 | Microprocessor, 16-Bit, 13MHz, CMOS, PQFP100, EIAJ, QFP-100 | Microprocessor, 16-Bit, 13MHz, CMOS, PQFP100, SHRINK, QFP-100 |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics |
package instruction | EIAJ, QFP-100 | QFP, | LFQFP, |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
Address bus width | 20 | 20 | 20 |
bit size | 16 | 16 | 16 |
boundary scan | NO | NO | NO |
maximum clock frequency | 40 MHz | 26 MHz | 26 MHz |
External data bus width | 16 | 16 | 16 |
Format | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO | NO |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | S-PQFP-G100 |
length | 20 mm | 20 mm | 14 mm |
low power mode | YES | YES | YES |
Number of terminals | 100 | 100 | 100 |
Maximum operating temperature | 85 °C | 85 °C | 70 °C |
Minimum operating temperature | -40 °C | -40 °C | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP | LFQFP |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH |
Maximum seat height | 3.15 mm | 3.15 mm | 1.66 mm |
speed | 20 MHz | 13 MHz | 13 MHz |
Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.5 mm |
Terminal location | QUAD | QUAD | QUAD |
width | 14 mm | 14 mm | 14 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
Other features | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE; NUMERIC COPROCESSOR INTERFACE | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE; NUMERIC COPROCESSOR INTERFACE | - |