K1S3216B1C-FI700 datasheet, PDF

K1S3216B1C-FI700: DescriptionPseudo Static RAM, 2MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, FBGA-48; Categorystorage storage; File Size181KB，10 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K1S3216B1C-FI700 Overview

Pseudo Static RAM, 2MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, FBGA-48

Parameter Name	Attribute value
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	70 ns
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	33554432 bit
Memory IC Type	PSEUDO STATIC RAM
memory width	16
Number of functions	1
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	2.1 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6 mm

	K1S3216B1C-FI700	K1S3216B1C-FI850
Description	Pseudo Static RAM, 2MX16, 70ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, FBGA-48	Pseudo Static RAM, 2MX16, 85ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, FBGA-48
Maker	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA
package instruction	VFBGA,	VFBGA,
Contacts	48	48
Reach Compliance Code	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A

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