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MAX9717DETA-T

Description
1.4W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size1MB,20 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Environmental Compliance  
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MAX9717DETA-T Overview

1.4W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8

MAX9717DETA-T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerRochester Electronics
Parts packaging codeSON
package instruction3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8
Contacts8
Reach Compliance Codeunknown
Nominal bandwidth22 kHz
Commercial integrated circuit typesAUDIO AMPLIFIER
Gain12 dB
JESD-30 codeS-XDSO-N8
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of channels1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Nominal output power1.4 W
Package body materialUNSPECIFIED
encapsulated codeHVSON
Package shapeSQUARE
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)245
Certification statusCOMMERCIAL
Maximum seat height0.8 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3 mm

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Description 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, 1.5 X 1.5 MM, UCSP-9 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, 1.5 X 1.5 MM, UCSP-9 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, 1.5 X 1.5 MM, UCSP-9 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, 1.5 X 1.5 MM, UCSP-9 1.4W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, 1.5 X 1.5 MM, UCSP-9
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead Lead free Lead free Contains lead Contains lead
Parts packaging code SON BGA BGA SON SON SON BGA BGA BGA
package instruction 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 1.5 X 1.5 MM, UCSP-9 1.5 X 1.5 MM, UCSP-9 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEC, TDFN-8 1.5 X 1.5 MM, UCSP-9 1.5 X 1.5 MM, UCSP-9 1.5 X 1.5 MM, UCSP-9
Contacts 8 9 9 8 8 8 9 9 9
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
Nominal bandwidth 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz 22 kHz
Commercial integrated circuit types AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 code S-XDSO-N8 S-PBGA-B9 S-PBGA-B9 S-XDSO-N8 S-XDSO-N8 S-XDSO-N8 S-PBGA-B9 S-PBGA-B9 S-PBGA-B9
length 3 mm 1.52 mm 1.52 mm 3 mm 3 mm 3 mm 1.52 mm 1.52 mm 1.52 mm
Humidity sensitivity level 1 1 1 1 1 1 1 1 1
Number of channels 1 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 8 9 9 8 8 8 9 9 9
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Nominal output power 1.4 W 1.4 W 1.4 W 1.4 W 1.4 W 1.4 W 1.4 W 1.4 W 1.4 W
Package body material UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON VFBGA VFBGA HVSON HVSON HVSON VFBGA VFBGA VFBGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 245 260 260 245 245 245 245 260 245
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 0.8 mm 0.67 mm 0.67 mm 0.8 mm 0.8 mm 0.8 mm 0.67 mm 0.67 mm 0.67 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD NOT SPECIFIED NOT SPECIFIED TIN LEAD TIN LEAD TIN LEAD NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal form NO LEAD BALL BALL NO LEAD NO LEAD NO LEAD BALL BALL BALL
Terminal pitch 0.65 mm 0.5 mm 0.5 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL BOTTOM BOTTOM DUAL DUAL DUAL BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3 mm 1.52 mm 1.52 mm 3 mm 3 mm 3 mm 1.52 mm 1.52 mm 1.52 mm
Gain 12 dB 6 dB 9 dB 9 dB - 6 dB 12 dB 12 dB -
Base Number Matches - 1 1 1 1 1 - - -

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