SPST, 2 Func, 1 Channel, 3 X 3 MM, 0.80 MM HEIGHT, MO229WEEC, TDFN-8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim |
Parts packaging code | DFN |
package instruction | 3 X 3 MM, 0.80 MM HEIGHT, MO229WEEC, TDFN-8 |
Contacts | 8 |
Reach Compliance Code | not_compliant |
Analog Integrated Circuits - Other Types | SPST |
JESD-30 code | S-XDSO-N8 |
JESD-609 code | e0 |
length | 3 mm |
Humidity sensitivity level | 1 |
Number of channels | 1 |
Number of functions | 2 |
Number of terminals | 8 |
Nominal off-state isolation | 76 dB |
On-state resistance matching specifications | 0.8 Ω |
Maximum on-state resistance (Ron) | 60 Ω |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | HVSON |
Package shape | SQUARE |
Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) | 245 |
Certification status | Not Qualified |
Maximum seat height | 0.8 mm |
Maximum supply voltage (Vsup) | 12 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
Maximum disconnect time | 75 ns |
Maximum connection time | 100 ns |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | NO LEAD |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3 mm |