MB84VD21194DA-85PBS datasheet, PDF

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MB84VD21194DA-85PBS: DescriptionMemory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69; Categorystorage storage; File Size206KB，60 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MB84VD21194DA-85PBS Overview

Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69

MB84VD21194DA-85PBS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	FUJITSU
Parts packaging code	BGA
package instruction	LFBGA, BGA69,10X10,32
Contacts	69
Reach Compliance Code	compliant
Maximum access time	85 ns
Other features	SRAM IS CONFIGURED AS 256K X 16/512K X 8
JESD-30 code	R-PBGA-B69
JESD-609 code	e0
length	11 mm
memory density	16777216 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+SRAM
Number of functions	1
Number of terminals	69
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA69,10X10,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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Description	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69	Memory Circuit, Flash+SRAM, 1MX16, CMOS, PBGA69, PLASTIC, BGA-69
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32	LFBGA, BGA69,10X10,32
Contacts	69	69	69	69	69	69	69	69
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
Maximum access time	85 ns	85 ns	85 ns	85 ns	85 ns	85 ns	85 ns	85 ns
Other features	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8	SRAM IS CONFIGURED AS 256K X 16/512K X 8
JESD-30 code	R-PBGA-B69	R-PBGA-B69	R-PBGA-B69	R-PBGA-B69	R-PBGA-B69	R-PBGA-B69	R-PBGA-B69	R-PBGA-B69
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16	16	16
Mixed memory types	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM	FLASH+SRAM
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	69	69	69	69	69	69	69	69
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32	BGA69,10X10,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
Maximum slew rate	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
Maker	FUJITSU	-	FUJITSU	FUJITSU	FUJITSU	FUJITSU	FUJITSU	FUJITSU

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