EPS448DC-25A datasheet, PDF - EEWORLD Datasheet

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EPS448DC-25A: DescriptionMicroprogram Sequencer, CMOS, CDIP28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，17 Pages; ManufacturerAltera (Intel)

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EPS448DC-25A Overview

Microprogram Sequencer, CMOS, CDIP28

EPS448DC-25A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Altera (Intel)
package instruction	DIP, DIP28,.3
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
Number of terminals	28
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	140 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

EPS448DC-25A Related Products

	EPS448DC-25A	EPS448LC-25A	EPS448DC-16	EPS448DI16	EPS448PI16	EPS448PI25	EPS448PC-25
Description	Microprogram Sequencer, CMOS, CDIP28	Microprogram Sequencer, CMOS, CQCC28	Microprogram Sequencer, CMOS, CDIP28,	Microprogram Sequencer, CMOS, CDIP28	Microprogram Sequencer, CMOS, PDIP28	Microprogram Sequencer, CMOS, PDIP28	Microprogram Sequencer, CMOS, PDIP28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP28,.3	QCCJ, LDCC28,.5SQ	DIP, DIP28,.3	DIP, DIP28,.3	DIP, DIP28,.3	DIP, DIP28,.3	DIP, DIP28,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 code	R-XDIP-T28	S-XQCC-J28	R-XDIP-T28	R-XDIP-T28	R-PDIP-T28	R-PDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of terminals	28	28	28	28	28	28	28
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.3	LDCC28,.5SQ	DIP28,.3	DIP28,.3	DIP28,.3	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	140 mA	140 mA	140 mA	200 mA	200 mA	200 mA	140 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER	BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Maker	Altera (Intel)	-	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)

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