M27C1001-10B3 datasheet, PDF - EEWORLD Datasheet

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M27C1001-10B3: Description128KX8 OTPROM, 100ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32; Categorystorage storage; File Size158KB，17 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M27C1001-10B3 Overview

128KX8 OTPROM, 100ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32

M27C1001-10B3 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	0.600 INCH, LEAD FREE, PLASTIC, DIP-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	100 ns
Other features	00.1.142
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e3
length	42.035 mm
memory density	1048576 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.83 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

M27C1001-10B3 Related Products

	M27C1001-10B3	M27C1001-10B6	M27C1001-10F6	M27C1001-10C3	M27C1001-10L3	M27C1001-10L1
Description	128KX8 OTPROM, 100ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32	128KX8 OTPROM, 100ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32	128KX8 UVPROM, 100ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	128KX8 OTPROM, 100ns, PQCC32, LEAD FREE, PLASTIC, LCC-32	128KX8 UVPROM, 100ns, CQCC32, CERAMIC, LCC-32	128KX8 UVPROM, 100ns, CQCC32, CERAMIC, LCC-32
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	DIP	DIP	DIP	QFJ	QFJ	QFJ
package instruction	0.600 INCH, LEAD FREE, PLASTIC, DIP-32	0.600 INCH, LEAD FREE, PLASTIC, DIP-32	LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32	LEAD FREE, PLASTIC, LCC-32	CERAMIC, LCC-32	CERAMIC, LCC-32
Contacts	32	32	32	32	32	32
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	100 ns	100 ns	100 ns	100 ns	100 ns
Other features	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142	00.1.142
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T32	R-PDIP-T32	R-CDIP-T32	R-PQCC-J32	R-CQCC-N32	R-CQCC-N32
JESD-609 code	e3	e3	e3	e3	e4	e4
length	42.035 mm	42.035 mm	41.885 mm	13.97 mm	13.97 mm	13.97 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	OTP ROM	OTP ROM	UVPROM	OTP ROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	85 °C	85 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	WDIP	QCCJ	WQCCN	WQCCN
Encapsulate equivalent code	DIP32,.6	DIP32,.6	DIP32,.6	LDCC32,.5X.6	LCC32,.45X.55	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE, WINDOW	CHIP CARRIER	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.83 mm	4.83 mm	5.72 mm	3.56 mm	2.28 mm	2.28 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	COMMERCIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Gold (Au)	Gold (Au)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm	11.43 mm
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	-
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics

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