IC,LOGIC MUX,QUAD,2-INPUT,F-TTL,DIP,16PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
series | F/FAST |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
length | 19.3 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.024 A |
Number of functions | 4 |
Number of entries | 2 |
Output times | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Maximum supply current (ICC) | 23 mA |
Prop。Delay @ Nom-Sup | 15.5 ns |
propagation delay (tpd) | 10.5 ns |
Certification status | Not Qualified |
Maximum seat height | 4.19 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |