CD54HC14FX Related Products
|
CD54HC14FX |
CD54HC14F/3 |
CD54HC14F/3A |
CD54HC14F/3W |
CD54HCT14F/3A |
CD74HCT14EX |
CD74HCT14M96 |
CD74HC14M96 |
CD74HC14EX |
CD74HC14MX |
Description |
Inverter, CMOS, CDIP14 |
Gate |
Inverter, CMOS, CDIP14 |
Inverter, CMOS, CDIP14 |
Inverter, CMOS, CDIP14 |
Inverter, CMOS, PDIP14, |
Inverter, CMOS, PDSO14, |
Inverter, CMOS, PDSO14, |
Inverter, CMOS, PDIP14, |
Gate |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
RCA |
package instruction |
DIP, DIP14,.3 |
, |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
DIP, DIP14,.3 |
SOP, SOP14,.25 |
SOP, SOP14,.25 |
DIP, DIP14,.3 |
, |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
JESD-30 code |
R-XDIP-T14 |
- |
R-XDIP-T14 |
R-XDIP-T14 |
R-XDIP-T14 |
R-PDIP-T14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDIP-T14 |
- |
Load capacitance (CL) |
50 pF |
- |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
- |
Logic integrated circuit type |
INVERTER |
- |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
INVERTER |
- |
MaximumI(ol) |
0.004 A |
- |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
- |
Number of terminals |
14 |
- |
14 |
14 |
14 |
14 |
14 |
14 |
14 |
- |
Maximum operating temperature |
125 °C |
- |
125 °C |
125 °C |
125 °C |
85 °C |
85 °C |
85 °C |
85 °C |
- |
Minimum operating temperature |
-55 °C |
- |
-55 °C |
-55 °C |
-55 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
Package body material |
CERAMIC |
- |
CERAMIC |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
encapsulated code |
DIP |
- |
DIP |
DIP |
DIP |
DIP |
SOP |
SOP |
DIP |
- |
Encapsulate equivalent code |
DIP14,.3 |
- |
DIP14,.3 |
DIP14,.3 |
DIP14,.3 |
DIP14,.3 |
SOP14,.25 |
SOP14,.25 |
DIP14,.3 |
- |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
IN-LINE |
- |
IN-LINE |
IN-LINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
- |
power supply |
2/6 V |
- |
2/6 V |
2/6 V |
5 V |
5 V |
5 V |
2/6 V |
2/6 V |
- |
Prop。Delay @ Nom-Sup |
41 ns |
- |
41 ns |
41 ns |
57 ns |
48 ns |
48 ns |
34 ns |
34 ns |
- |
Schmitt trigger |
YES |
- |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
- |
surface mount |
NO |
- |
NO |
NO |
NO |
NO |
YES |
YES |
NO |
- |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
Temperature level |
MILITARY |
- |
MILITARY |
MILITARY |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
Terminal form |
THROUGH-HOLE |
- |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
THROUGH-HOLE |
- |
Terminal pitch |
2.54 mm |
- |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
2.54 mm |
- |
Terminal location |
DUAL |
- |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
- |