Multi-Port SRAM, 2KX8, 25ns, CMOS, CQCC52, HERMETIC SEALED, LCC-52
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | LCC |
package instruction | QCCN, |
Contacts | 52 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 25 ns |
Other features | INTERRUPT FLAG; AUTOMATIC POWER-DOWN |
JESD-30 code | S-CQCC-N52 |
JESD-609 code | e3 |
length | 19.05 mm |
memory density | 16384 bit |
Memory IC Type | MULTI-PORT SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 52 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCN |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 2.2098 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 19.05 mm |