EEPROM, 32KX8, 70ns, Parallel, CMOS, CPGA28, CERAMIC, PGA-28
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Atmel (Microchip) |
Parts packaging code | PGA |
package instruction | PGA, |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 70 ns |
Other features | AUTOMATIC WRITE |
JESD-30 code | R-CPGA-P28 |
JESD-609 code | e3 |
length | 16.5 mm |
memory density | 262144 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 245 |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.4 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | 40 |
width | 14 mm |