GS8342T08/09/18/36AE-250/200/167
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaDDR-II™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write (x36, x18, and x9) and Nybble Write (x8) function
• Burst of 2 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
• Pin-compatible with present 9Mb, 18Mb, 72Mb and 144Mb
devices
36Mb SigmaDDR-II™
Burst of 2 SRAM
250 MHz–167 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Clocking and Addressing Schemes
The GS8342T08/09/18/36AE SigmaDDR-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
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The GS8342T08/09/18/36AE are built in compliance with the
SigmaDDR-II SRAM pinout standard for Common I/O
synchronous SRAMs. They are 37,748,736-bit (36Mb)
SRAMs. The GS8342T08/09/18/36AE SigmaDDR-II SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
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Parameter Synopsis
-250
tKHKH
tKHQV
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.5 ns
Rev: 1.07 8/2012
No
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1/32
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SigmaDDR-II™ Family Overview
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inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Each internal read and write operation in a SigmaDDR-II B2
RAM is two times wider than the device I/O bus. An input data
bus de-multiplexer is used to accumulate incoming data before
it is simultaneously written to the memory array. An output
data multiplexer is used to capture the data produced from a
single memory array read and then route it to the appropriate
output drivers as needed.
When a new address is loaded into a x18 or x36 version of the
part, A0 is used to initialize the pointers that control the data
multiplexer / de-multiplexer so the RAM can perform "critical
word first" operations. From an external address point of view,
regardless of the starting point, the data transfers always follow
the same sequence {0, 1} or {1, 0} (where the digits shown
represent A0).
Unlike the x18 and x36 versions, the input and output data
multiplexers of the x8 and x9 versions are not preset by
address inputs and therefore do not allow "critical word first"
operations. The address fields of the x8 and x9 SigmaDDR-II
B2 RAMs are one address pin less than the advertised index
depth (e.g., the 4M x 8 has a 2M addressable index, and A0 is
not an accessible address pin).
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
© 2006, GSI Technology
GS8342T08/09/18/36AE-250/200/167
1M x 36 SigmaDDR-II SRAM—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
2
NC
DQ27
NC
DQ29
NC
DQ30
DQ31
V
REF
NC
NC
DQ33
NC
DQ35
NC
TCK
3
SA
DQ18
DQ28
DQ19
DQ20
DQ21
DQ22
V
DDQ
DQ32
DQ23
DQ24
DQ34
DQ25
DQ26
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
5
BW2
BW3
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
6
K
K
7
BW1
BW0
SA
8
LD
SA
9
10
NC
NC
DQ17
NC
DQ15
NC
NC
V
REF
DQ13
DQ12
NC
DQ11
NC
DQ9
TMS
11
CQ
DQ8
DQ7
DQ16
DQ6
DQ5
DQ14
ZQ
DQ4
DQ3
DQ2
DQ1
DQ10
DQ0
TDI
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for
SA
SA
SA
11 x 15 Bump BGA—13 x 15 mm
2
Body—1 mm Bump Pitch
No
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Notes:
1. BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17; BW2 controls writes to DQ18:DQ26; BW3 controls writes to
DQ27:DQ35
2. A2 and A10 are reserved for future use as an address pin for higher density devices. They are not connected to the die on this device.
They may be left floating or be treated as an MCL pin (Must Connect Low) to assure the site will successfully accomodate a future, higher
density device. These pins may be marked as V
SS
, NC, or MCL by some vendors of compatible SRAMs.
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Expansion Addresses
A10
A2
72Mb
144Mb
Rev: 1.07 8/2012
2/32
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NC
SA0
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
V
SS
NC
NC
NC
NC
NC
V
SS
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
NC
NC
NC
NC
NC
NC
SA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
V
DDQ
SA
© 2006, GSI Technology
GS8342T08/09/18/36AE-250/200/167
2M x 18 SigmaDDR-II SRAM—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
2
NC
DQ9
NC
NC
NC
DQ12
NC
V
REF
NC
NC
DQ15
NC
NC
NC
TCK
3
SA
NC
NC
DQ10
DQ11
NC
DQ13
V
DDQ
NC
DQ14
NC
NC
DQ16
DQ17
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
5
BW1
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
6
K
K
7
NC
BW0
SA
8
LD
SA
9
SA
10
SA
NC
DQ7
NC
NC
NC
NC
V
REF
DQ4
NC
NC
DQ1
NC
NC
TMS
11
CQ
DQ8
NC
NC
DQ6
DQ5
NC
ZQ
NC
DQ3
DQ2
NC
NC
DQ0
TDI
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for
SA
SA
SA
11 x 15 Bump BGA—13 x 15 mm
2
Body—1 mm Bump Pitch
Re
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Notes:
1. BW0 controls writes to DQ0:DQ8; BW1 controls writes to DQ9:DQ17
2. A2, A7, and B5 are reserved for future use as an address pin for higher density devices. They are not connected to the die on this device.
They may be left floating or be treated as an MCL pin (Must Connect Low) to assure the site will successfully accomodate a future, higher
density device. These pins may be marked as V
SS
, NC, or MCL by some vendors of compatible SRAMs.
Expansion Address
A2
A7
B5
72Mb
144Mb
288Mb
Rev: 1.07 8/2012
No
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SA0
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
V
SS
NC
NC
NC
NC
NC
V
SS
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
NC
NC
NC
NC
NC
NC
SA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
NC
V
DDQ
© 2006, GSI Technology
GS8342T08/09/18/36AE-250/200/167
4M x 9 SigmaDDR-II SRAM—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
2
NC
NC
NC
NC
NC
NC
NC
V
REF
NC
NC
DQ7
NC
NC
NC
TCK
3
SA
NC
NC
NC
DQ5
NC
DQ6
V
DDQ
NC
NC
NC
NC
NC
DQ8
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
5
NC
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
6
K
K
7
NC
BW
SA
8
LD
SA
9
SA
10
SA
NC
NC
NC
NC
NC
NC
V
REF
DQ2
NC
NC
NC
NC
NC
TMS
11
CQ
DQ4
NC
NC
DQ3
NC
NC
ZQ
NC
NC
DQ1
NC
NC
DQ0
TDI
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nd
ed
for
SA
SA
SA
11 x 15 Bump BGA—13 x 15 mm
2
Body—1 mm Bump Pitch
Re
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m
Notes:
1. Unlike the x36 and x18 versions of this device, the x8 and x9 versions do not give the user access to A0 and A1. SA0 is set to 0 at the
beginning of each access.
2. A2, A7, and B5 are reserved for future use as an address pin for higher density devices. They are not connected to the die on this device.
They may be left floating or be treated as an MCL pin (Must Connect Low) to assure the site will successfully accomodate a future, higher
density device. These pins may be marked as V
SS
, NC, or MCL by some vendors of compatible SRAMs.
No
t
Expansion Address
A2
A7
B5
72Mb
144Mb
288Mb
Rev: 1.07 8/2012
4/32
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SA
V
SS
V
SS
NC
NC
NC
NC
NC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
NC
NC
NC
NC
NC
NC
SA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
NC
V
DDQ
© 2006, GSI Technology
GS8342T08/09/18/36AE-250/200/167
4M x 8 SigmaDDR-II SRAM—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
2
NC
NC
NC
NC
NC
NC
NC
V
REF
NC
NC
DQ6
NC
NC
NC
TCK
3
SA
NC
NC
NC
DQ4
NC
DQ5
V
DDQ
NC
NC
NC
NC
NC
DQ7
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
5
NW1
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
6
K
K
7
NC
NW0
SA
8
LD
SA
9
SA
10
SA
NC
NC
NC
NC
NC
NC
V
REF
DQ1
NC
NC
NC
NC
NC
TMS
11
CQ
DQ3
NC
NC
DQ2
NC
NC
ZQ
NC
NC
DQ0
NC
NC
NC
TDI
De
sig
Ne
w
me
nd
ed
for
SA
SA
SA
11 x 15 Bump BGA—13 x 15 mm
2
Body—1 mm Bump Pitch
Notes:
1. Unlike the x36 and x18 versions of this device, the x8 and x9 versions do not give the user access to A0 and A1. SA0 is set to 0 at the
beginning of each access.
2. NW0 controls writes to DQ0:DQ3; NW1 controls writes to DQ4:DQ7
3. A2, A7, and B5 are reserved for future use as an address pin for higher density devices. They are not connected to the die on this device.
They may be left floating or be treated as an MCL pin (Must Connect Low) to assure the site will successfully accomodate a future, higher
density device. These pins may be marked as V
SS
, NC, or MCL by some vendors of compatible SRAMs.
No
t
Re
co
m
Expansion Address
A2
A7
B5
72Mb
144Mb
288Mb
Rev: 1.07 8/2012
5/32
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SA
V
SS
V
SS
NC
NC
NC
NC
NC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
NC
NC
NC
NC
NC
NC
SA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
NC
V
DDQ
© 2006, GSI Technology
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