512MX16 FLASH 1.8V PROM, 35ns, PBGA63, 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LFBGA-63
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | BGA |
package instruction | LFBGA, BGA63,10X12,32 |
Contacts | 63 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 35 ns |
command user interface | YES |
Data polling | NO |
JESD-30 code | R-PBGA-B63 |
JESD-609 code | e0 |
length | 15 mm |
memory density | 8589934592 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of departments/size | 8K |
Number of terminals | 63 |
word count | 536870912 words |
character code | 512000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA63,10X12,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
page size | 1K words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.8 V |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.4 mm |
Department size | 64K |
Maximum standby current | 0.00005 A |
Maximum slew rate | 0.015 mA |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | NO |
width | 8.5 mm |