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AM27HB010-90DI

Description
UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
Categorystorage    storage   
File Size544KB,19 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM27HB010-90DI Overview

UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32

AM27HB010-90DI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeDIP
package instructionWDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time90 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T32
JESD-609 codee0
length42.1005 mm
memory density1048576 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum standby current0.001 A
Maximum slew rate0.1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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