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MXPLAD15KP130C

Description
Trans Voltage Suppressor Diode, 15000W, 130V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1
CategoryDiscrete semiconductor    diode   
File Size215KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MXPLAD15KP130C Overview

Trans Voltage Suppressor Diode, 15000W, 130V V(RWM), Bidirectional, 1 Element, Silicon, PLASTIC PACKAGE-1

MXPLAD15KP130C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
package instructionS-PSSO-G1
Contacts1
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum breakdown voltage176 V
Minimum breakdown voltage144 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeS-PSSO-G1
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation15000 W
Number of components1
Number of terminals1
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation2.5 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage130 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
PLAD15KP5.0 thru PLAD15KP400CA, e3
15,000 W SURFACE MOUNT TRANSIENT
VOLTAGE SUPPRESSOR
SCOTTSDALE DIVISION
DESCRIPTION
These Microsemi 15 kW Transient Voltage Suppressors (TVSs)
are designed for applications requiring protection of voltage-
sensitive electronic devices that may be damaged by harsh or
severe voltage transients including lightning per IEC61000-4-5 and
classes with various source impedances described herein. This
series is available in 5.0 to 400 volt standoff voltages (V
WM
) in both
unidirectional and bidirectional offered in one surface mount
device. Microsemi also offers numerous other TVS products to
meet higher and lower power demands and special applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
FEATURES
Available in both Unidirectional and Bidirectional
construction (Bidirectional with C or CA suffix)
Low profile surface mount
Available in tape-and-reel or waffle pack
Selections for 5.0 to 400 volts standoff voltages (V
WM
)
Suppresses transients up to 15,000 watts @ 10/1000 µs
(see Figure 1)
Fast response
Optional 100%
screening for avionics grade
is
available by adding MA prefix to part number for added
100% temperature cycle -55
o
C to +125
o
C (10X) as well
as surge (3X) and 24 hours HTRB with post test V
Z
&
I
R
(in the operating direction for unidirectional or both
directions for bidirectional)
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are also available
by adding MQ, MX, or MV prefixes respectively to part
numbers.
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2
and IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1,2,3,4: PLAD15KP5.0A to 400A or CA
Class 5: PLAD15KP5.0A to 400A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1,2,3,4: PLAD15KP5.0A to 400A or CA
Secondary lightning protection per IEC61000-4-5 with
2 Ohms source impedance:
Class 2,3: PLAD15KP5.0A to 400A or CA
Class 4: PLAD15KP5.0 to 54A or CA
Pin injection protection per RTCA/DO-160D for
Waveform 4 (6.4/69 µs):
Level 4: PLAD15KP5.0A to 400A or CA
Level 5: PLAD15KP5.0A to 100A or CA
Pin injection protection per RTCA/DO-160D for
Waveform 5A (40/120 µs):
Level 4: PLAD15KP5.0A to 28A or CA
MAXIMUM RATINGS
Operating and Storage temperature: -55
º
C to +150
º
C
Peak Pulse Power dissipation at 25
º
C: 15,000 watts at
10/1000
μs
(also see Figures 1 and 2)
Impulse repetition rate (duty factor): 0.05%
t
clamping
(0 volts to V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Thermal resistance: 0.2 C/W junction to case or 50
º
C/W
junction to ambient when mounted on FR4 PC board with
recommended mounting pad (see last page)
Steady-State Power dissipation: 50 watts at T
C
= 100
o
C
with good heat sink, or 2.5 watts at T
A
= 25
º
C if mounted on
FR4 PC board as described for thermal resistance
Forward Surge Voltage: 3.5 V maximum @ 500 Amps 8.3
ms half-sine wave (unidirectional devices only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
©
2007
10-12-2007 REV G
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Tin-Lead or RoHS Compliant
annealed matte-Tin plating readily solderable per
MIL-STD-750, method 2026
MARKING: Body marked with part number
POLARITY: For unidirectional devices, the cathode
is on the metal backside (package bottom)
WEIGHT: 1 gram (approximate)
TAPE & Reel: Standard per EIA-481-B (add “TR”
suffix to part number)
See package dimensions on last page
PLAD15KP5.0- 400CA, e3
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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