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SMLG33C

Description
Trans Voltage Suppressor Diode, 3000W, 33V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AB, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size233KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

SMLG33C Overview

Trans Voltage Suppressor Diode, 3000W, 33V V(RWM), Bidirectional, 1 Element, Silicon, DO-215AB, PLASTIC PACKAGE-2

SMLG33C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDO-215AB
package instructionPLASTIC PACKAGE-2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum breakdown voltage44.9 V
Minimum breakdown voltage36.7 V
Breakdown voltage nominal value40.8 V
Maximum clamping voltage59 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-215AB
JESD-30 codeR-PDSO-G2
JESD-609 codee0
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation3000 W
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation1.61 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage33 V
Maximum reverse current5 µA
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
SMLJ5.0 thru SMLJ170CA
and SMLG5.0 thru SMLG170CA
SCOTTSDALE DIVISION
SURFACE MOUNT 3000 Watt
Transient Voltage Suppressor
DESCRIPTION
The SMLJ5.0-170A or SMLG5.0-170A series of 3000 W Transient Voltage
Suppressors (TVSs) protects a variety of voltage-sensitive components
from destruction or degradation. It is available in J-bend design (SMCJ)
with the DO-214AB package for greater PC board mounting density or in a
Gull-wing design (SMCG) in the DO-215AB for visible solder connections.
Selections include unidirectional and bidirectional. They can protect from
secondary lightning effects per IEC61000-4-5 and class levels defined
herein, or for inductive switching environments and induced RF protection.
Since their response time is virtually instantaneous, they can also be used
in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
FEATURES
Economical surface mount design in both J-bend or
Gull-wing terminations
Available in both Unidirectional and Bidirectional
construction with a C or CA suffix
Selections for 5.0 to 170 volts standoff voltages (V
WM
)
Suppresses transients up to 3000 watts @ 10/1000 µs
(see Figure 1)
Fast response
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers
Axial-lead packages for thru-hole mounting available
as 5KP5.0–110A with 5000 W rating (consult factory
for other surface mount options)
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2
and IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
Class 1 & 2: SML 5.0 to SML 170A or CA
Class 3: SML 5.0 to SML 150A or CA
Class 4: SML 5.0 to SML 75A or CA
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
Class 1: SML 5.0 to SML 170A or CA
Class 2: SML 5.0 to SML 90A or CA
Class 3: SML 5.0 to SML 48A or CA
Class 4: SML 5.0 to SML 24A or CA
Secondary lightning protection per IEC61000-4-5 with
2 Ohms source impedance:
Class 2: SML 5.0 to SML 43A or CA
Class 3: SML 5.0 to SML 22A or CA
Class 4: SML 5.0 to SML10A or CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25
º
C: 3000 watts at
10/1000
µs
(also see Fig 1,2, and 3)
Impulse repetition rate (duty factor): 0.01%
t
clamping
(0 volts to
V
(BR)
min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65
º
C to +150
º
C
Thermal resistance: 17.5
º
C/W junction to lead, or
77.5
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power dissipation: 6 watts at T
L
= 45
o
C,
or 1.61 watts at T
A
= 25
º
C when mounted on FR4 PC
board with recommended footprint
Forward Surge at 25ºC: 200 Amps peak impulse of
8.3 ms half-sine wave (unidirectional only)
Solder temperatures: 260
º
C for 10 s (maximum)
Copyright
2002
6-26-2003 REV A
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-bend)
leads, tin-lead plated solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band. No
marking on bidirectional devices
MARKING: Part number without SM and G or J
prefix (e.g. L5.0, L5.0A, L5.0CA, L36, L36A, L36CA,
etc.)
TAPE & REEL option: Standard per EIA-481-2 with
16 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add “TR” suffix to part number)
WEIGHT
:
0.25 grams
SML 5.0 – 170V
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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