Standard SRAM, 512KX8, 20ns, CMOS, CDSO32, CERAMIC, LCC-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Micross |
Parts packaging code | DLCC |
package instruction | SON, |
Contacts | 32 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 20 ns |
Other features | LOW POWER STANDBY MODE |
JESD-30 code | R-CDSO-N32 |
JESD-609 code | e0 |
length | 20.955 mm |
memory density | 4194304 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | SON |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 2.54 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 11.43 mm |