|
CLC425MDC |
CLC425AJM5X |
CLC425AJ |
Description |
IC OP-AMP, 800 uV OFFSET-MAX, 1900 MHz BAND WIDTH, UUC, DIE, Operational Amplifier |
IC OP-AMP, 800 uV OFFSET-MAX, 1900 MHz BAND WIDTH, PDSO5, SOT-23, 5 PIN, Operational Amplifier |
IC OP-AMP, 800 uV OFFSET-MAX, 1900 MHz BAND WIDTH, CDIP8, CERDIP-8, Operational Amplifier |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
Parts packaging code |
WAFER |
SOT-23 |
DIP |
package instruction |
DIE, |
LSSOP, TSOP5/6,.11,37 |
DIP, DIP8,.3 |
Reach Compliance Code |
compliant |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
Nominal Common Mode Rejection Ratio |
100 dB |
100 dB |
100 dB |
Maximum input offset voltage |
800 µV |
800 µV |
800 µV |
JESD-30 code |
X-XUUC-N |
R-PDSO-G5 |
R-GDIP-T8 |
Negative supply voltage upper limit |
-7 V |
-7 V |
-7 V |
Nominal Negative Supply Voltage (Vsup) |
-5 V |
-5 V |
-5 V |
Number of functions |
1 |
1 |
1 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
UNSPECIFIED |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
encapsulated code |
DIE |
LSSOP |
DIP |
Package shape |
UNSPECIFIED |
RECTANGULAR |
RECTANGULAR |
Package form |
UNCASED CHIP |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
IN-LINE |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Nominal slew rate |
350 V/us |
350 V/us |
350 V/us |
Supply voltage upper limit |
7 V |
7 V |
7 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
NO |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
NO LEAD |
GULL WING |
THROUGH-HOLE |
Terminal location |
UPPER |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Nominal Uniform Gain Bandwidth |
1900000 kHz |
1900000 kHz |
1900000 kHz |
Maximum average bias current (IIB) |
20 µA |
20 µA |
- |
Contacts |
- |
5 |
8 |
Architecture |
- |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
Maximum bias current (IIB) at 25C |
- |
20 µA |
20 µA |
frequency compensation |
- |
YES (AVCL>=10) |
YES (AVCL>=10) |
JESD-609 code |
- |
e0 |
e0 |
low-dissonance |
- |
NO |
NO |
Number of terminals |
- |
5 |
8 |
Encapsulate equivalent code |
- |
TSOP5/6,.11,37 |
DIP8,.3 |
method of packing |
- |
TAPE AND REEL |
TUBE |
power supply |
- |
+-5 V |
+-5 V |
Programmable power |
- |
YES |
YES |
Maximum seat height |
- |
1.45 mm |
5.08 mm |
minimum slew rate |
- |
200 V/us |
200 V/us |
Maximum slew rate |
- |
18 mA |
18 mA |
technology |
- |
BIPOLAR |
BIPOLAR |
Terminal surface |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal pitch |
- |
0.95 mm |
2.54 mm |
Minimum voltage gain |
- |
7070 |
7070 |
broadband |
- |
YES |
YES |
width |
- |
1.65 mm |
7.62 mm |