SSI75T202-ID datasheet, PDF - EEWORLD Datasheet

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SSI75T202-ID: DescriptionDTMF Signaling Circuit, CMOS, CDIP18,; CategoryWireless rf/communication Telecom circuit; File Size359KB，8 Pages; ManufacturerSilicon Systems Inc.

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SSI75T202-ID Overview

DTMF Signaling Circuit, CMOS, CDIP18,

SSI75T202-ID Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Silicon Systems Inc.
package instruction	DIP, DIP18,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T18
JESD-609 code	e0
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	DTMF SIGNALING CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

SSI75T202-ID Related Products

	SSI75T202-ID	SSI75T202-CD	SSI75T202-CP	SSI75T202-IP	SSI75T203-CP	SSI75T203-IP	SSI75T203-CD	SSI75T203-ID
Description	DTMF Signaling Circuit, CMOS, CDIP18,	DTMF Signaling Circuit, CMOS, CDIP18,	DTMF Signaling Circuit, CMOS, PDIP18,	DTMF Signaling Circuit, CMOS, PDIP18,	DTMF Signaling Circuit, CMOS, PDIP18,	DTMF Signaling Circuit, CMOS, PDIP18,	DTMF Signaling Circuit, CMOS, CDIP18,	DTMF Signaling Circuit, CMOS, CDIP18,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.	Silicon Systems Inc.
package instruction	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T18	R-XDIP-T18	R-PDIP-T18	R-PDIP-T18	R-PDIP-T18	R-PDIP-T18	R-XDIP-T18	R-XDIP-T18
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Number of terminals	18	18	18	18	18	18	18	18
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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