Isolation Amplifier, 1 Func, 3750V Isolation-Min, 100MHz Band Width, CMOS, PDIP8, DIP-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | HP(Keysight) |
Parts packaging code | DIP |
package instruction | DIP, DIP8,.3 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Amplifier type | ISOLATION AMPLIFIER |
Nominal bandwidth (3dB) | 100 MHz |
Maximum common mode voltage | 2.8 V |
Minimum insulation voltage | 3750 V |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
length | 9.8 mm |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.7 mm |
Supply voltage upper limit | 5.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum voltage gain | 8.4 |
Minimum voltage gain | 7.6 |
width | 7.62 mm |
HCPL-7840#060 | HCPL-7840#300 | |
---|---|---|
Description | Isolation Amplifier, 1 Func, 3750V Isolation-Min, 100MHz Band Width, CMOS, PDIP8, DIP-8 | Isolation Amplifier, 1 Func, 3750V Isolation-Min, 100MHz Band Width, CMOS, PDSO8, SMT-8 |
Is it Rohs certified? | incompatible | incompatible |
Maker | HP(Keysight) | HP(Keysight) |
Parts packaging code | DIP | SOIC |
package instruction | DIP, DIP8,.3 | SOP, SOP8,.4 |
Contacts | 8 | 8 |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
Amplifier type | ISOLATION AMPLIFIER | ISOLATION AMPLIFIER |
Nominal bandwidth (3dB) | 100 MHz | 100 MHz |
Maximum common mode voltage | 2.8 V | 2.8 V |
Minimum insulation voltage | 3750 V | 3750 V |
JESD-30 code | R-PDIP-T8 | R-PDSO-G8 |
JESD-609 code | e0 | e0 |
length | 9.8 mm | 9.8 mm |
Humidity sensitivity level | 1 | 1 |
Number of functions | 1 | 1 |
Number of terminals | 8 | 8 |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP |
Encapsulate equivalent code | DIP8,.3 | SOP8,.4 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 4.7 mm | 4.455 mm |
Supply voltage upper limit | 5.5 V | 5.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | YES |
technology | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Maximum voltage gain | 8.4 | 8.4 |
Minimum voltage gain | 7.6 | 7.6 |
width | 7.62 mm | 6.35 mm |