MT55L256L36PB-7.5 datasheet, PDF

MT55L256L36PB-7.5: DescriptionZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119; Categorystorage storage; File Size488KB，30 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT55L256L36PB-7.5 Overview

ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	BGA
package instruction	14 X 22 MM, PLASTIC, MS-028BHA, BGA-119
Contacts	119
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	4.2 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	36
Number of functions	1
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum standby current	0.01 A
Minimum standby current	3.14 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	14 mm

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