Standard SRAM, 256KX18, 4ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | QFP |
package instruction | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 |
Contacts | 100 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 4 ns |
Other features | PIPELINE ARCHITECTURE |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
length | 20 mm |
memory density | 4718592 bit |
Memory IC Type | STANDARD SRAM |
memory width | 18 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
power supply | 2.5/3.3,3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.01 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.375 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
width | 14 mm |
GVT71256G18T-5 | GVT71256G18T-3 | GVT71256G18B-6 | GVT71256G18B-5 | |
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Description | Standard SRAM, 256KX18, 4ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Standard SRAM, 256KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Standard SRAM, 256KX18, 4ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | Standard SRAM, 256KX18, 4ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
Parts packaging code | QFP | QFP | BGA | BGA |
package instruction | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
Contacts | 100 | 100 | 119 | 119 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 4 ns | 3.5 ns | 4 ns | 4 ns |
Other features | PIPELINE ARCHITECTURE | PIPELINE ARCHITECTURE | PIPELINE ARCHITECTURE | PIPELINE ARCHITECTURE |
Maximum clock frequency (fCLK) | 133 MHz | 166 MHz | 117 MHz | 133 MHz |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 | R-PBGA-B119 |
length | 20 mm | 20 mm | 22 mm | 22 mm |
memory density | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 18 | 18 | 18 | 18 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 119 | 119 |
word count | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256KX18 | 256KX18 | 256KX18 | 256KX18 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP | BGA | BGA |
Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.63X.87 | BGA119,7X17,50 | BGA119,7X17,50 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm | 2.4 mm | 2.4 mm |
Maximum standby current | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
Minimum standby current | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
Maximum slew rate | 0.375 mA | 0.425 mA | 0.35 mA | 0.375 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | GULL WING | GULL WING | BALL | BALL |
Terminal pitch | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | BOTTOM | BOTTOM |
width | 14 mm | 14 mm | 14 mm | 14 mm |