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XC4013XL-08HT176M

Description
FPGA, 576 CLBS, 10000 GATES, 166 MHz, PQFP240
Categorysemiconductor    Programmable logic devices   
File Size123KB,16 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Download Datasheet Parametric View All

XC4013XL-08HT176M Overview

FPGA, 576 CLBS, 10000 GATES, 166 MHz, PQFP240

XC4013XL-08HT176M Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals240
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
Processing package descriptionPLASTIC, QFP-240
stateDISCONTINUED
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeFLATPACK, FINE PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.5000 mm
terminal coatingTIN LEAD
Terminal locationQUAD
Packaging MaterialsPLASTIC/EPOXY
organize576 CLBS, 10000 GATES
Maximum FCLK clock frequency166 MHz
Number of configurable logic modules576
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Number of equivalent gate circuits10000
The maximum delay of a CLB module1.6 ns
R
Product Obsolete/Under Obsolescence
XC4000E and XC4000X Series Field Programmable Gate Arrays
XC4000XL Electrical Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance:
Preliminary:
Unmarked:
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device
families. Values are subject to change. Use as estimates, not for production.
Based on preliminary characterization. Further changes are not expected.
Specifications not identified as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions.
All specifications subject to change without notice.
XC4000XL D.C. Characteristics
Absolute Maximum Ratings
Description
V
CC
V
IN
V
TS
V
CCt
T
STG
T
SOL
T
J
Supply voltage relative to Ground
Input voltage relative to Ground (Note 1)
Voltage applied to 3-state output (Note 1)
Longest Supply Voltage Rise Time from 1 V to 3V
Storage temperature (ambient)
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
Junction Temperature
Ceramic packages
Plastic packages
-0.5 to 4.0
-0.5 to 5.5
-0.5 to 5.5
50
-65 to +150
+260
+150
+125
Units
V
V
V
ms
°C
°C
°C
°C
6
Note 1: Maximum DC excursion above V
cc
or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to
achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot toV
CC
+2.0 V, provided this over or
undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended
periods of time may affect device reliability.
Recommended Operating Conditions
Symbol
V
CC
V
IH
V
IL
T
IN
Notes:
Description
Supply voltage relative to Gnd, T
J
= 0
°C
to +85°C
Supply voltage relative to Gnd, T
J
= -40°C to +100°C
High-level input voltage
Low-level input voltage
Input signal transition time
Commercial
Industrial
Min
3.0
3.0
50% of V
CC
0
Max
3.6
3.6
5.5
30% of V
CC
250
Units
V
V
V
V
ns
At junction temperatures above those listed above, all delay parameters increase by 0.35% per
°C.
Input and output measurement threshold is ~50% of V
CC
.
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