128KX8 STANDARD SRAM, 8ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| Parts packaging code | SOJ |
| package instruction | SOJ, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.B |
| Maximum access time | 8 ns |
| JESD-30 code | R-PDSO-J32 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOJ |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| MCM6726AWJ8R2 | MCM6726AWJ10R2 | MCM6726AWJ8 | MCM6726AWJ12R2 | |
|---|---|---|---|---|
| Description | 128KX8 STANDARD SRAM, 8ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | 128KX8 STANDARD SRAM, 10ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | 128KX8 STANDARD SRAM, 8ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | 128KX8 STANDARD SRAM, 12ns, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOJ | SOJ | SOJ | SOJ |
| package instruction | SOJ, | SOJ, | SOJ, | SOJ, SOJ32,.44 |
| Contacts | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Maximum access time | 8 ns | 10 ns | 8 ns | 12 ns |
| JESD-30 code | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOJ | SOJ | SOJ | SOJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND | J BEND |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maker | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) |
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