AM27256-30DC datasheet, PDF - EEWORLD Datasheet

AM27256-30DC: DescriptionUVPROM, 32KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28; Categorystorage storage; File Size363KB，15 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27256-30DC Overview

UVPROM, 32KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	WDIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	300 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	262144 bi
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programming voltage	12.5 V
Certification status	Not Qualified
Maximum seat height	5.588 mm
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
Base Number Matches	1

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