IC,SMPS CONTROLLER,CURRENT-MODE,BCDMOS,DIP,14PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microchip |
package instruction | CERAMIC, DIP-14 |
Reach Compliance Code | unknown |
Analog Integrated Circuits - Other Types | SWITCHING CONTROLLER |
control mode | CURRENT-MODE |
Control Technology | PULSE WIDTH MODULATION |
Maximum input voltage | 120 V |
Minimum input voltage | 10 V |
JESD-30 code | R-CDIP-T14 |
JESD-609 code | e0 |
length | 20.32 mm |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Maximum output current | 0.01 A |
Nominal output voltage | 4 V |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 3.683 mm |
surface mount | NO |
Switch configuration | SINGLE |
Maximum switching frequency | 1000 kHz |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
HV9111C | HV9112C | HV9113C | |
---|---|---|---|
Description | IC,SMPS CONTROLLER,CURRENT-MODE,BCDMOS,DIP,14PIN,CERAMIC | IC,SMPS CONTROLLER,CURRENT-MODE,BCDMOS,DIP,14PIN,CERAMIC | IC,SMPS CONTROLLER,CURRENT-MODE,BCDMOS,DIP,14PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | Microchip | Microchip | Microchip |
package instruction | CERAMIC, DIP-14 | CERAMIC, DIP-14 | CERAMIC, DIP-14 |
Reach Compliance Code | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
control mode | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
Control Technology | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
Maximum input voltage | 120 V | 80 V | 120 V |
Minimum input voltage | 10 V | 9 V | 10 V |
JESD-30 code | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 |
JESD-609 code | e0 | e0 | e0 |
length | 20.32 mm | 20.32 mm | 20.32 mm |
Number of functions | 1 | 1 | 1 |
Number of terminals | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Maximum output current | 0.01 A | 0.01 A | 0.01 A |
Nominal output voltage | 4 V | 4 V | 4 V |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.683 mm | 3.683 mm | 3.683 mm |
surface mount | NO | NO | NO |
Switch configuration | SINGLE | SINGLE | SINGLE |
Maximum switching frequency | 1000 kHz | 1000 kHz | 1000 kHz |
technology | BICMOS | BICMOS | BICMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.62 mm | 7.62 mm |