S29CD016J0MFFI130 datasheet, PDF

S29CD016J0MFFI130: DescriptionFlash, 512KX32, 54ns, PBGA80, BGA-80; Categorystorage storage; File Size1MB，86 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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S29CD016J0MFFI130 Overview

Flash, 512KX32, 54ns, PBGA80, BGA-80

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Cypress Semiconductor
package instruction	LBGA, BGA80,8X10,40
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	54 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B80
JESD-609 code	e1
length	13 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	32
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,30
Number of terminals	80
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX32
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA80,8X10,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	1.8/2.6,2.6 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	2K,16K
Maximum standby current	0.00006 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	2.75 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.6 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	11 mm

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