CD4011AD
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | not_compliant |
| series | 4000/14000/40000 |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 15 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.00031 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5/15 V |
| Prop。Delay @ Nom-Sup | 75 ns |
| propagation delay (tpd) | 75 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 4.06 mm |
| Maximum supply voltage (Vsup) | 12 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| CD4011AD | CD4011AF | |
|---|---|---|
| Description | CD4011AD | 4000/14000/40000 SERIES, QUAD 2-INPUT NAND GATE, CDIP14, HERMETIC SEALED, CERAMIC, MO-001-AB, DIP-14 |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, DIP14,.3 | HERMETIC SEALED, CERAMIC, MO-001-AB, DIP-14 |
| Contacts | 14 | 14 |
| Reach Compliance Code | not_compliant | not_compliant |
| series | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 code | R-GDIP-T14 | R-GDIP-T14 |
| JESD-609 code | e0 | e0 |
| Load capacitance (CL) | 15 pF | 15 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE |
| Number of functions | 4 | 4 |
| Number of entries | 2 | 2 |
| Number of terminals | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5/15 V | 5/15 V |
| Prop。Delay @ Nom-Sup | 75 ns | 75 ns |
| propagation delay (tpd) | 75 ns | 75 ns |
| Certification status | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO |
| Maximum seat height | 4.06 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 12 V | 12 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
